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31 | | | thermal gap filler k=2.5
Specification: Thermal Gap Filler K=2.5
Detail: Features High performance Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electronics; Electric...
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32 | | | thermal gap filler k=3.0
Specification: Thermal Gap Filler K=3.0
Detail: Features Thermal conductivity 3.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electroni...
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33 | | | thermal gap filler k=4.0
Specification: Thermal Gap Filler K=4.0
Detail: Features Thermal conductivity 4.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electroni...
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34 | | | two-part thermal gap filler
Specification: TWO-PART THERMAL GAP FILLER
Detail: Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 100% solid, no cure by-product Applications Automotive electronic...
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35 | | | thermal tape xk-tn08
Specification: XK-TN08
Detail: XK-TN08 is a double sided adhesive, thermal conductive tape. it is designed for applications where strong constructural bond is reqiured. XK-TN08 provides high bond strenghth and eliminates need for mechanical fasteners.
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36 | | | non-silicone thermal pad k=2.0
Specification: Non-Silicone Thermal Pad K=2.0
Detail: Features No siloxane volatiles High thermal performance Good electrical insulation Ultra conformable Applications Optical devices Telecommunication Medical equipment Atuomotive ECU Description Th...
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37 | | | non silicone thermal pad k=6.0
Specification: Non silicone thermal pad K=6.0
Detail: Features No siloxane volatiles High thermal performance Exellent compressibility Low hardness, conformable Electrical insulation Applications Optical precision devices Telecommunication Industr...
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38 | | | non silicone thermal pad k=3.0
Specification: Non silicone thermal pad K=3.0
Detail: Features No siloxane volatiles High thermal performance Exellent compressibility Low hardness, conformable Electrical insulation Applications Optical precision devices Telecommunication Industri...
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39 | | | non silicone thermal pad k=5.0
Specification: Non silicone thermal pad K=5.0
Detail: Features No siloxane volatiles High thermal performance Exellent compressibility Low hardness, conformable Electrical insulation Applications Optical precision devices Telecommunication Industr...
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40 | | | non-silicone thermal gel k=1.5
Specification: Non-silicone thermal gel K=1.5
Detail: Features High thermal performance Low thermal resistance Ultra conforming Low stress Applications Automotive electronics Comsumer electronics Telecommunications LED Description XK-GN15 ...
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