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Shenzhen
Products >> Non silicone thermal pad K=5.0

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| Product Name: |
Non silicone thermal pad K=5.0
|
| Supply Ability: |
1 |
| Related proudcts |
gap filler, thermal pad, non-silicone, |
| Specifications |
Non silicone thermal pad K=5.0 |
| Price Term: |
FOB |
| Port of loading: |
SHENZHEN /HONGKONG |
| Minimum Order |
1000 |
| Unit Price: |
Negotiated |
|
Features No siloxane volatiles
High thermal performance
Exellent compressibility
Low hardness, conformable
Electrical insulation
Applications Optical precision devices
Telecommunication
Industrial and medical electronics
Automotive ECU
Description XK-PN50 is a soft and compliant thermal gap filler pad with thermal conductivity of 5.0W/mK. It offers exceptional thermal performance at low pressure due to low-modulus formulation. Designed for silicone-sensitive applications, offering high electrical insulation and excellent thermally conductive. |
| Company: |
Shenzhen
|
| Contact: |
Mr. Oscar Lee |
| Address: |
Rm616-619 Huafeng xin'an Commercial Building ,Block 45 ,Bao'an District, Shenzhen,China |
| Postcode: |
518000 |
| Tel: |
8615989474551 |
| Fax: |
8675527579350 |
| E-mail: |
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