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Shenzhen
Products >> Non-silicone Thermal Gel K=3.0
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| Product Name: |
Non-silicone Thermal Gel K=3.0
|
| Supply Ability: |
1 |
| Related proudcts |
thermal gel, non-silicone gel, |
| Specifications |
Non-silicone Thermal Gel K=3.0 |
| Price Term: |
FOB |
| Port of loading: |
SHENZHEN /HONGKONG |
| Minimum Order |
1000 |
| Unit Price: |
Negotiated |
|
Features
High thermal performance
Low thermal resistance
Ultra conforming
Low stress, non pump-out
Applications
Automotive electronics
Comsumer electronics
Telecommunications
LED
Description
XK-GN30 is a non-curing, non-silicone based, high performance and low thermal impedance thermal putty gel. It has a high reliability, and never dry out even in severe environment application(-30℃). The wet-out feature will reduce contact thermal resistance and optimize thermal transfer. |
| Company: |
Shenzhen
|
| Contact: |
Mr. Oscar Lee |
| Address: |
Rm616-619 Huafeng xin'an Commercial Building ,Block 45 ,Bao'an District, Shenzhen,China |
| Postcode: |
518000 |
| Tel: |
8615989474551 |
| Fax: |
8675527579350 |
| E-mail: |
|
|
|
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